#Cam350 code#
#Cam350 Pc#

Some also require the addition of an ET chapter, a V-CUT test point, a drill hole, a borehole test line, a PAD, an identification mark, and so on.Р”Р„fter panelized according to the panel type on the trimming table, the artwork border is made according to the production specification. Need to lead V-CUT V-CUT corner (Edit-> Line Change-> Fillet, if you need to round corners, use the following command: Edit-> Line Change-> Chamfer). Then add the AI hole (Add->Drill Hit under drilling edit status), position hole, optical point, and material number(Add->Text).

#Cam350 code#

b: UL MARK and DATE CODE marks can be etched on the PCB by the copper etching method (without causing a short-circuit or affecting the safety of the circuit) when the customer has special requirements or the PCB has no character layer.Р”Р„ccording to the specified sets way (Edit->Copy), plus work side.a: UL MARK and DATE CODE are generally added to the character layer, but cannot be added to the part area and character box (unless otherwise specified), nor to the area drilled, punched, or routed.Then add the UL MARK and DATE CODE marks as required by the customer. View the Solder Mask and line PAD matching (Analysis->DRC), solder mask and line spacing, solder mask and line PAD spacing (copy line and solder mask to one layer, then check this layer with the Analysis->DRC command ), the minimum width of the solder mask, and whether there is a size-specific solder mask (Add->Flash) at the NPTH.Р”В¬heck the character line width (Info->Report->Dcode), height (Info->Measure->Point-point), hollow diameter, spacing between character and line PAD, the distance between character and routing edge, character and slote hole spacing, whether or not the character and PTH(no tin) spacing meet the manufacturing requirements.

After the above is completed, check whether the spacing between the circuit and the line, the line and the PAD, PAD, and PAD meet the manufacturing requirements. Whether the line PAD of the NPTH hole is cancelled (Edit->Delete). >Snap Pad to Drill command if drilling is biased, use Edit->Layers->Snap Drill to Pad command), Ring of circuit PAD is large enough (Analysis->DRC), circuit and NPTH Whether the edge of the hole, the edge of the groove, or the edge of the molding meet the manufacturing requirements.

#Cam350 Pc#

Then, according to the PC board type and the thickness of the copper foil on the substrate (Edit->Change->Dcode), check whether the offset of the circuit PAD is relative to the drill hole (if the PAD is biased, use Edit->Layers. Then check the minimum drilling hole size, the hole-to-hole (or slot) minimum spacing (Analysis->Check Drill), and the minimum distance between the hole edge and the routing edge (Info->Measure->Object-Object) Satisfy process capability.Р”Р‡irst, measure the minimum wire diameter and wire spacing (Analysis->DRC) to see if it meets the process capability. When the customer does not provide the drilling file, you can use the aperture hole to turn to Flash (Utilities-> Draw-> Custom, Utilities-> Draw-> Flash-> Interactive) and then turn to drill (Under drilling hole editing status, Utilities->Gerber to Drill) First import the file (File->Import->Autoimport) automatically, check whether the data is complete, align the layers (Edit->Layers->Align) and set the origin (Edit->Change->Origin ->Datum Coordinate), arrange the layers in a certain order (Edit->Layers->Reorder) and delete the unused layers (Edit->Layers->Reorder).